Specifications
Power
| Power Envelope | 15–75 W |
|---|
Memory
| Memory | 64 GB |
|---|---|
| Memory Type | LPDDR5 |
| Memory Bandwidth (GB/s) | 204.8 |
Compute
| CPU Cores | 12 |
|---|---|
| Tensor Cores | 64 |
| NVDLA Engines | 2 |
| GPU CUDA Cores | 2,048 |
| GPU Architecture | Ampere |
Thermal
| Module Max TTP Temperature | 85 °C |
|---|
Identity
| Device Type | System-on-Module |
|---|---|
| Jetson Family | Jetson AGX Orin |
Mechanical
| Form Factor | 699-pin B2B (100x87mm) |
|---|
Performance
| Max AI Performance (TOPS) | 248 TOPS |
|---|---|
| Max FP32 TFLOPS | 4.8 TFLOPS |
Category: NVIDIA / NVIDIA Hardware / Production Modules
Questions about this product
- 3U VPX board for Jetson AGX Orin Industrial with the lowest max power consumption
- Aitech computers with a Jetson AGX Orin Industrial module and cold-plate cooling
- Curtiss-Wright systems that use IGX Thor
- Diamond Systems OSB-ER-64G-1T vs OSB-ER-64GXT-1T: temperature range and AI TOPS
- EIZO Rugged Solutions VPX boards that list MIL-STD-461
- Interface card or camera kit with the most GMSL inputs for AGX Orin
- Jetson AGX Orin 32GB vs AGX Orin Industrial: AI TOPS, power envelope and max TTP temperature
- Jetson AGX Xavier Industrial vs AGX Orin Industrial: AI TOPS, FP32 and power envelope
- Jetson module with at least 200 TOPS and the highest TTP temperature for an engine bay
- Jetson modules with 2 NVDLA engines and a max power envelope of 25 W or less
- Jetson Orin modules without DLA engines
- Jetson production modules rated for an 85 °C max TTP temperature
- Jetson production modules with 12 or more CPU cores
- Jetson production modules with 64 or more Tensor Cores
- Jetson production modules with the 699-pin B2B (100x87mm) connector
- Lowest-power NVIDIA module with at least 64 GB of memory
- Neousys NRU-230V-AWP vs NRU-51V+ / NRU-51V: temperature, GMSL and Jetson modules
- NVIDIA production module with the highest FP32 TFLOPS
- Production modules with more than 200 GB/s of memory bandwidth