select.parts

Specifications

I/O

HDMIYes
mPCIeYes
CAN BusYes
M.2 SlotYes
M.2 Slots (Key / Size)M-key 2242/2280, E-key 2230
USB Ports0
Digital IOYes
Serial COMYes
MIPI Camera Inputs1
PCIe Max Generation3
M.2 Slot Count2
CAN Port Count2
Ethernet Ports0
PCIe Slot Count1
Mini-PCIe Slot Count2
Digital I/O Channels (Total)8
Serial Port Count4
Max Ethernet Speed10GbE

Power

Power Input7–20 V

Thermal

Max Operating Temp (device)80 °C
Min Operating Temp (device)-25 °C

Identity

ManufacturerDiamond Systems
Product LineDiamond Osbourne
Hardware TypeCarrier Board
Lifecycle StatusActive

Software

JetPack Version Support6.2

Compliance

CertificationsMIL-STD-810H (shock/vibration tested)

Mechanical

Shock RatingMIL-STD-810H, Method 516.8: terminal peak sawtooth waveform, 40G, 11ms duration, 3 shocks/direction (operational); 6ms duration, 2 shocks/direction (non-operational); tested at x, y, z axes and envelope axis.
Dimensions120 × 115 mm
Vibration RatingMIL-STD-810H, Method 514.8, Table 514.8 C-VII, Category 4: random vibration, tested at x, y, z and envelope axis, 40 minutes/axis, 2.24 Grms.

Marketplace

NVIDIA Marketplace Hardware SolutionCarrier Boards

Performance

Max AI Performance (TOPS)275 TOPS
Max FP32 TFLOPS5.32 TFLOPS

Compatibility

Jetson / IGX Module FamilyJetson AGX Orin, Jetson AGX Orin Industrial
Category: NVIDIA / Partner Ecosystem / Compute Foundations / Carrier Boards

Questions about this product

More Carrier Boards