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Vendors/ADLINK/Partner Developer Kits/DLAP-211-Orin Dev Kit

Specifications

I/O

HDMIYes
mPCIeYes
CAN BusYes
M.2 SlotYes
USB Ports5
Digital IOYes
SD/TF CardYes
Serial COMYes
PCIe Max Generation3
CAN Port Count1
Ethernet Ports2
Mini-PCIe Slot Count1
Serial Port Count1
Max Ethernet Speed1GbE

Power

Power Input12 V

Storage

Onboard Storage128 GB

Thermal

CoolingFan
Max Operating Temp (device)70 °C
Min Operating Temp (device)-20 °C
Operating Temp ConditionRequires airflow, Depends on power mode, Depends on installed peripherals

Identity

ManufacturerADLINK
Product LineADLINK DLAP
Hardware TypeFull System
Lifecycle StatusActive

Compliance

CertificationsCE, FCC Class B, UL, CB

Mechanical

Shock RatingOperating 100G, half sine 11ms duration w/ SD, M.2 SSD
Dimensions148 × 120 × 52 mm
Vibration RatingOperating 5Grms, 5-500Hz, 3 axes w/M.2 SSD

Marketplace

NVIDIA Marketplace Hardware SolutionFull Systems

Performance

Max AI Performance (TOPS)100 TOPS
Max FP32 TFLOPS1.88 TFLOPS

Connectivity

WiFi/BluetoothYes
Cellular4G/LTE

Compatibility

Jetson / IGX Module FamilyJetson Orin Nano, Jetson Orin NX

Environmental

Humidity Rating~95% @40°C (non-condensing, optional with fanless solution) without adapter
Category: NVIDIA / Partner Ecosystem / Compute Foundations / Partner Developer Kits

Questions about this product

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